Vault 7: Projects

This publication series is about specific projects related to the Vault 7 main publication.

2010-2013 Microchip Technology Inc. DS39881E-page 233
PIC24FJ64GA004 FAMILY
TABLE 27-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ64GA004 Family:
Operating Junction Temperature Range T
J -40 +140 °C
Operating Ambient Temperature Range T
A -40 +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O = ({VDD – VOH} x IOH) + (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ TA)/JA W
TABLE 27-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 300 mil SOIC
JA 49 °C/W (Note 1)
Package Thermal Resistance, 6x6x0.9 mm QFN
JA 33.7 °C/W (Note 1)
Package Thermal Resistance, 8x8x1 mm QFN JA 28 °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP JA 39.3 °C/W (Note 1)
Note 1: Junction to ambient thermal resistance; Theta-
JA (JA) numbers are achieved by package simulations.

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